• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    A semiconductor device includes: a circuit unit including a semiconductor chip; a plurality of pin terminals formed in a rod shape extending in a same direction from the circuit unit and electrically connected to the circuit unit; a sealing resin portion sealing 5 the circuit unit and first portions of the plurality of pin terminals positioned on a side of the circuit unit; and a plurality of covering resin portions integrally extending from an outer surface of the sealing resin portion from Which second portions of the plurality of pin terminals protrude, the plurality of covering resin portions being formed in a cylindrical shape respectively covering base end portions of the second portions of the 10 plurality of pin terminals, which are positioned on a side of the sealing resin portion.
    公开号:NL2023711A
    申请号:NL2023711
    申请日:2019-08-27
    公开日:2020-07-08
    发明作者:Umeda Soichiro；Kyutoku Atsushi
    申请人:Shindengen Electric Mfg；
    IPC主号:
    专利说明:

    [0001] [0001] The present invention relates to a semiconductor device and a semiconductor device manufacturing method.
    [0003] [0003] [Patent Document 1} Japanese Application Publication No. 2009-059812
    [0004] [0004] Miniaturization is required for this type of semiconductor device. However, in the semiconductor device of Patent Document 1, it is necessary to secure a creeping distance from a predetermined pin terminal to another pin terminal along the outer surface of the sealing resin portion. For this reason, there is a problem that the space between the adjacent pin terminals cannot be reduced, thereby inhibiting the miniaturization of the semiconductor device.
    [0005] [0005] The present invention has been made in view of such problems, and it is an object of the present invention to provide a semiconductor device and a semiconductor device manufacturing method capable of achieving miniaturization while securing a creeping distance between terminal pins.
    [0006] [0006] A semiconductor device according to one aspect of the present invention includes: a circuit unit including a semiconductor chip; a plurality of pin terminals formed in a rod shape extending in a same direction from the circuit unit and electrically connected to the circuit unit; a sealing resin portion sealing the circuit unit and first portions of the plurality of pin terminals positioned on a side of the circuit unit; and aplurality of covering resin portions integrally extending from an outer surface of the sealing resin portion from which second portions of the plurality of pin terminals protrude, the plurality of covering resin portions being formed in a cylindrical shape respectively covering base end portions of the second portions of the plurality of pin terminals, which are positioned on a side of the sealing resin portion.
    [0007] [0007] A semiconductor device manufacturing method according to one aspect of the present invention includes: a connection step of electrically connecting a plurality of pin terminals to a circuit unit such that the plurality of pin terminals formed in a rod shape extend in a same direction from the circuit unit including a semiconductor chip; after the connection step, an accommodation step of accommodating the circuit unit and first portions of the plurality of pin terminals positioned on a side of the circuit unit in a first cavity of a mold, and inserting second portions of the plurality of pin terminals respectively in a plurality of pin insertion holes of the mold extending from an inner surface of the first cavity; after the accommodation step, a molding step of pouring a resin into the first cavity to form a sealing resin portion sealing the circuit unit and the first portions of the plurality of pin terminals, wherein: in the accommodation step, after inserting the second portions of the plurality of pin terminals respectively into the plurality of pin insertion holes, a pair of slide portions of the mold are caused to protrude from an inner circumference of each pin insertion hole and to sandwich a tip end portion of the second portion of each pin terminal positioned away from the first cavity, thereby forming a plurality of second cavities connected to the first cavity, the plurality of second cavities being surrounded by an outer circumference of a base end portion of the second portion of each pin terminal positioned close to the first cavity, the inner circumference of each pin insertion hole, and the pair of slide portions; and in the molding step, theresin is flown into the second cavity to form a plurality of cylindrical covering resin portions respectively covering the base end portions of the second portions of the plurality of pin terminals. [Effects of the Invention]
    [0008] [0008] According to the present invention, the miniaturization of the semiconductor device can be achieved.BRIEF DESCRIPTION OF THE DRAWINGS
    [0009] [0009] FIG. 1 is a cross-sectional view showing a semiconductor device according to an embodiment of the present invention.
    [0010] [0010] Hereinafter, an embodiment of the present invention will be described with reference to FIGS. 1-10.
    [0011] [0011] The circuit unit 2 constitutes a circuit of the semiconductor device I. The circuit unit 2 includes a semiconductor chip 6 and a wiring. The semiconductor chip 6 is formed in a plate shape, and has electrodes on both upper and lower surfaces. The semiconductor chip 6 of the present embodiment is a semiconductor element that generates heat by energization, such as a diode or a transistor. The wiring mainlyconnects the semiconductor chip 6 and the pin terminals 3 described later.
    [0012] [0012] The circuit unit 2 of the present embodiment includes a plate-like lead frame 7 that constitutes the wiring of the circuit unit 2. The lead frame 7 is manufactured by punching a plate material having conductivity, such as a copper plate. In the semiconductor device 1, the lead frame 7 includes a plurality of leads 11 each formed in a band plate shape and spaced apart from each other. The lead frame 7 is formed with a plurality of insertion holes 12 penetrating in a plate thickness direction thereof. Specifically, the plurality of insertion holes 12 are formed respectively in the plurality of leads 11. Although the number of leads 11 or insertion holes 12 in FIG. 1 is two, it is not limited thereto.
    [0013] [0013] The plurality of pin terminals 3 are formed in a bar shape extending in the same direction from the circuit unit 2. The plurality of pin terminals 3 are electrically connected to the wiring of the circuit unit 2. Although the number of pin terminals 3 in FIG. 1 is two, it is not limited thereto.
    [0014] [0014] The first portion 21 of each pin terminal 3 is formed with an overhanging portion 23 that overhangs from an outer circumference of the pin terminal 3. The overhanging portion 23 is in surface contact with the first main surface 7a of the lead frame 7 In a state where the first portion 21 of the pin terminal 3 is inserted into the insertion hole 12 of the lead frame 7. Here, the overhanging portion 23 may, for example, be in surface contact with the second main surface 7b of the lead frame 7.
    [0015] [0015] The semiconductor device 1 of the present embodiment further includes a wiring substrate 8. The wiring substrate 8 has a wiring portion 30 which constitutes the wiring of the circuit unit 2 together with the lead frame 7. The wiring substrate 8 is disposed to face the second main surface 7b of the lead frame 7. A portion of the first portion 21 of the pin terminal 3 protruding from the second main surface 7b of the lead frame 7 (hereinafter referred to as a protruding portion 24 of the pin terminal 3) is joined bysolder to the wiring portion 30 of the wiring substrate 8.
    [0016] [0016] The wiring substrate 8 may be, for example, a printed wiring substrate. The wiring substrate 8 of the present embodiment is a ceramic substrate 8 having a ceramic plate 31 and metal plate portions 32 and 33 formed on both main surfaces 31a and 31b thereof. The ceramic substrate 8 is disposed such that the first main surface 31a of the ceramic plate 31 faces the second main surface 7b of the lead frame 7. The first metal plate portion 32 formed on the first main surface 31a of the ceramic plate 31 constitutes the wiring portion 30 of the wiring substrate 8. The semiconductor chip 6 is joined to the first metal plate portion 32. The second metal plate portion 33 formed on the second main surface 31b of the ceramic plate 31 is formed in a region overlapping the first metal plate portion 32 in the thickness direction of the ceramic plate 31. The second metal plate portion 33 is electrically insulated from the first metal plate portion 32 by the ceramic plate 31.
    [0017] [0017] Specifically, the plurality of first metal plate portions 32 are formed at an interval on the first main surface 31a of the ceramic plate 31. Although the number of first metal plate portions 32 in FIG. 1 is two, it is not limited thereto. One first metal plate portion 32 of the plurality of first metal plate portions 32 is joined by solder to the lower surface of the semiconductor chip 6. In other words, the semiconductor chip 6 is sandwiched between one first metal plate portion 32 (wiring substrate 8) and one lead 11 (lead frame 7). The protruding portions 24 of the plurality of pin terminals 3 are respectively joined by solder to the different first metal plate portions 32 (wiring portions 30).
    [0018] [0018] The sealing resin portion 4 seals the circuit unit 2 including the semiconductor chip 6 and the lead frame 7, and the first portions 21 of the plurality of pin terminals 3. The second portions 22 of the plurality of pin terminals 3 protrude from an outer surface of the sealing resin portion 4. In the present embodiment, the outer surface of the sealing resin portion 4 from which the second portions 22 of the plurality of pin terminals 3 protrude is a flat upper surface 4a facing upward.
    [0019] [0019] The plurality of covering resin portions 5 integrally extend from the upper surface 4a of the sealing resin portion 4 from which the second portions 22 of the plurality of pin terminals 3 protrude. In other words, the plurality of covering resin portions 5 are formed integrally with the sealing resin portion 4. Each covering resin portion 5 is formed in a cylindrical shape that covers a base end portion 22A of the second portion 22 of each pin terminal 3, which is positioned on the sealing resin portion 4 side. For this reason, only a tip end portion 22B of the second portion 22 of each pin terminal 3 protrudes from each covering resin portion 5.
    [0020] [0020]
    [0021] [0021] In the semiconductor device 1 of the present embodiment illustrated in FIG. 1, a current path from one pin terminal 3 to the other pin terminal 3 is formed by the semiconductor chip 6, the lead frame 7, and the first metal plate portion 32 of the ceramic substrate 8. Specifically, the semiconductor device 1 is formed the current path passing through one pin terminal 3 (and one lead 11), one first metal plate portion 32, the semiconductor chip 6, the other lead 11, and the other pin terminal 3 (and the other first metal plate portion 32) in this order.
    [0022] [0022] Next, a semiconductor device 1 manufacturing method of manufacturing the above-described semiconductor device 1 will be described. As shown in FIG. 2, the method of manufacturing the semiconductor device 1 includes a connection step S1, an accommodation step S2, and a molding step S3.
    [0023] [0023] In the connection step S1 of the present embodiment, first, the semiconductor chip 6 1s disposed on the first main surface 31a side of the ceramic substrate 8. Specifically, the semiconductor chip 6 is disposed so as to overlap the first metal plate portion 32 of the ceramic substrate 8.
    [0024] [0024]
    [0025] [0025] Here, the step of inserting the first portions 21 of the pin terminals 3 into the insertion holes 12 of the lead frame 7 may be performed, for example, before disposing the lead frame 7 on the first main surface 31a side of the ceramic substrate 8. In this case, the lead frame 7 is disposed on the first main surface 31a side of the ceramic substrate 8 so that the protruding portion 24 of the first portion 21 of each pin terminal 3 contacts the corresponding one first metal plate portion 32 of the ceramic substrate 8.
    [0026] [0026] Finally, the semiconductor chip 6, the lead frame 7, and the ceramic substrate 8 (wiring substrate 8) are electrically connected to one another by appropriately joining the semiconductor chip 6, the lead frame 7, the ceramic substrate 8, and the pin terminals 3. In other words, the circuit unit 2 is formed. Additionally, the pin terminals 3 are electrically connected to the circuit unit 2. The joining of the semiconductor chip 6, the lead frame 7, the ceramic substrate 8, and the pin terminals 3 can be performed by, for example, solder reflow. Solder paste for performing the solder reflow only need be applied to each joining portion before disposing the semiconductor chip 6, the lead frame 7, and the pin terminals 3 on the ceramic substrate 8 and before attaching the pin terminals 3 to the lead frame 7.
    [0027] [0027] As shown in FIG. 2, the accommodation step S2 is performed after the connection step S1. In the accommodation step S2, as shown in FIG. 5, a connection unit 10 which connected the circuit unit 2 and the plurality of pin terminals 3 is accommodated inside a mold 100. The mold 100 has: a first cavity C1 accommodating the circuit unit 2 and the first portions 21 of the plurality of pin terminals 3 positioned on the circuit unit 2 side; and a plurality of pin insertion holes 101 for individually inserting the second portions 22 of the plurality of pin terminals 3 positioned away from the circuit unit 2. Each pin insertion hole 101 extends from an inner surface of the first cavity C1.
    [0028] [0028] As shown in FIG. 5, a plurality of slide portions 102 are provided inside the mold 100. The slide portions 102 in a pair protrude from the inner circumference of each pin insertion hole 101. The pair of slide portions 102 are slidable in directions approaching or separating from each other in the radial direction of the corresponding pin insertion hole 101 (left and right directions in FIG. 5). The pair of slide portions 102 is disposed at a position away from the first cavity Cl in an extending direction (upward direction in FIG. 5) of the pin insertion hole 101 with respect to the pin insertion hole 101. The pair of slide portions 102 sandwiches the second portion 22 of the pin terminal 3 inserted into each pin insertion hole 101. The pair of slide portions 102 may be slidable, for example, to a position not protruding from the inner circumference of each pin insertion hole 101.
    [0029] [0029] In the present embodiment, each slide portion 102 is formed in a plate shapewhose thickness direction is the extending direction of the pin insertion hole 101. The plate thickness of each slide portion 102 is smaller than the dimension in the extending direction of the pin insertion hole 101. Each slide portion 102 is disposed at a position apart from the tip end (upper end in FIG. 5) of the pin insertion hole 101 in the extending direction of the pin insertion hole 101. That is, each slide portion 102 is positioned between the base end {the end on the first cavity C1 side) and the tip end of the pin insertion hole 101 in the extending direction of the pin insertion hole 101.
    [0030] [0030] As shown in FIG. 8, the tip end portion 102A in the projecting direction of the slide portion 102 with respect to the pin insertion hole 101 is formed in a tapered shape. Specifically, the tip end portion 102A of the slide portion 102 is formed such that the thickness of the slide portion 102 becomes smaller as it approaches the tip end of the slide portion 102 in the projecting direction. A first surface 102b of the tip end portion 102A of the slide portion 102, which faces the first cavity C1 side in the thickness direction of the slide portion 102, extends in the protruding direction of the slide portion 102 (direction orthogonal to the extending direction of the pin insertion hole 101). On the other hand, a second surface 102c of the tip end portion 102A of the slide portion 102, which faces the tip end side of the pin insertion hole 101, tilts so as to be closer to the first surface 102b as it approaches the tip end of the slide portion 102 in the projecting direction.
    [0031] [0031] Further, as shown in FIG. 6, in plan view seen from the extending direction ofthe pin insertion hole 101, the tip end of each slide portion 102 in contact with the circumferential surface of the pin terminal 3 is formed in an arc shape corresponding to the shape of the circumferential surface of the pin terminal 3.
    [0032] [0032] Although the number of slide portions 102 in the mold 100 may be, for example, twice the number of pin insertion holes 101 (pin terminals 3), it may be, for example, less than the twice the number of pin insertion holes 101, as shown in FIG. 6. In the configuration illustrated in FIG. 6, some of the slide portions 102 is provided for the two pin insertion holes 101.
    [0033] [0033] More specifically, as shown in FIGS. 4 and 5, the mold 100 of the present embodiment has a lower mold 110 and an upper mold 120 which are movable in the vertical direction.
    [0034] [0034] The upper mold 120 is formed with a plurality of pin insertion holes 101. Each pin insertion hole 101 extends upward from a bottom surface of the second concave portion 121. Additionally, the plurality of slide portions 102 are provided inside the upper mold 120.
    [0035] [0035] Furthermore, the mold 100 of the present embodiment has a driving member 130 for causing the pair of slide portions 102 corresponding to each pin insertion hole 101 to slide in the direction in which they approach each other. The driving member 130 has a main body portion 131 and a plurality of pressing portions 132.
    [0036] [0036] The plurality of pressing portions 132 are provided integrally with the main body portion 131. For this reason, as shown in FIG. 7, as the main body portion 131moves toward the upper surface 120a of the upper mold 120, the plurality of slide portions 102 simultaneously slide in the protruding direction. That is, the pair of slide portions 102 corresponding to the same pin insertion hole 101 can slide in the direction in which they approach each other. On the other hand, as shown in FIG. 5, as the main body portion 131 moves in the direction away from the upper surface 1204 of the upper mold 120, the plurality of slide portions 102 simultaneously slide in the direction opposite to the protruding direction.
    [0037] [0037] Although the number of pressing portions 132 in the driving member 130 may be, for example, twice the number of pin insertion holes 101, it may be, for example, less than twice the number of pin insertion holes 101, as shown in FIG. 6. In the configuration illustrated in FIG. 6, some of the pressing portions 132 is provided for the plurality of (four in FIG. 6) slide portions 102 each corresponding to different pin insertion holes 101.
    [0038] [0038] Here, the configuration for causing the slide portion 102 to slide in the direction opposite to the protruding direction is not limited to a spring or the like and may be arbitrary. The configuration for causing the slide portion 102 to slide in the direction opposite to the protruding direction may be, for example, another driving member having a main body portion and a pressing portion, similarly to the driving member 130 described above. The other driving member pushes the pressing portion toward the slide portion 102, thereby causing the slide portion 102 to slide in the direction opposite to the protruding direction, that is, causing the pair of slide portions 102 corresponding to each pin insertion hole 101 to slide in the direction in which they separate from each other.
    [0039] [0039] In the accommodation step S2 of the present embodiment, first, as shown in FIG. 4, the connection unit 10 is placed on the lower mold 110 of the mold 100. In this state, the second metal plate portion 33 of the ceramic substrate 8 in the connection unit 10 is in surface contact with the bottom surface of the first concave portion 111 of the lower mold 110. Further, the frame portion 13 of the lead frame 7 is placed on the upper surface 110a of the lower mold 110. In the first concave portion 111, portions of the connection unit 10 on the second main surface 7b side of the lead frame 7 (the ceramic substrate 8, the semiconductor chip 6, and the protruding portions 24 of the plurality of pin terminals 3) are accommodated.
    [0040] [0040] Next, as shown in FIG. 5, the upper mold 120 is stacked on the lower mold 110. In this state, the first cavity C1 including the first concave portion 111 of the lower mold 110 and the second concave portion 121 of the upper mold 120 is formed. The first cavity Cl accommodates the circuit unit 2 and the first portions 21 of the plurality of pin terminals 3 (positioned on the circuit unit 2 side) of the connection unit 10. Further, the second portions 22 of the plurality of pin terminals 3 are inserted into the plurality of pin insertion holes 101 of the upper mold 120. Further, the frame portion 13 of the lead frame 7 is sandwiched between the lower mold 110 and the upper mold 120.
    [0041] [0041] Furthermore, in the accommodation step S2, after inserting the second portion 22 of each pin terminal 3 into each pin insertion hole 101, as shown in FIGS. 7 and 8, the pair of slide portions 102 is caused to protrude from the inner circumference of each pin insertion hole 101, so that the tip end portion 22B of the second portion 22 of each pin terminal 3 is sandwiched by the pair of slide portions 102. The tip end portion 22B ofthe second portion 22 of the pin terminal 3 is a portion of the second portion 22 of the pin terminal 3 inserted into the pin insertion hole 101, which is positioned apart from the first cavity C 1.
    [0042] [0042] When sandwiching the tip end portion 22B of the second portion 22 of the pin terminal 3, the main body 131 of the driving member 130 is moved toward the upper surface 1204 of the upper mold 120. As a result, the pair of slide portions 102 corresponding to the same pin insertion hole 101 slides in the direction in which they approach each other, thereby sandwiching the tip end portion 22B of the second portion 22 of the pin terminal 3. Further, the tip end portions 22B of the second portions 22 of the plurality of pin terminals 3 inserted into the plurality of pin insertion holes 101 are each sandwiched simultaneously by the pair of slide portions 102.
    [0043] [0043] In the accommodation step S2 of the present embodiment, the pair of slide portions 102 sandwich a part of the tip end portion 22B of the second portion 22 of the pin terminal 3, which is adjacent to the base end portion 22A of the second portion 22 of the pin terminal 3. That is, the pair of slide portions 102 does not sandwich a part of the tip end portion 22B of the second portion 22 of the pin terminal 3, which is apart from the base end portion 22A of the second portion 22 of the pin terminal 3. The base end portion 22A of the second portion 22 of the pin terminal 3 is a portion of the second portion 22 of the pin terminal 3 inserted into the pin insertion hole 101, which is positioned close to the first cavity Cl. Here, the pair of slide portions 102 may sandwich, for example, the entire tip end portion 22B of the second portion 22 of the pin terminal 3.
    [0044] [0044]
    [0045] [0045] Furthermore, in the state in which the tip end portion 22B of the second portion 22 of each pin terminal 3 is sandwiched by the pair of slide portions 102, a plurality of second cavities C2 are formed. Each second cavity C2 is a space surrounded by the outer circumference of the base end portion 22A of the second portion 22 of each pin terminal 3, the inner circumference of each pin insertion hole 101 facing thereto, and the pair of slide portions 102, and is connected to one cavity Cl. The second cavity C2 is formed for each pin insertion hole 101.
    [0046] [0046] Each second cavity C2 is a space on the base end side (first cavity C1 side) of each pin insertion hole 101, and is divided from the space on the tip end side of each pin insertion hole 101 by the pair of slide portions 102 and the pin terminal 3. As shown in FIG. 9, the tip ends of the pair of slide portions 102 are pressed against, and thus in close contact with, the circumference of the pin terminal 3, and the tip ends of the pair of slide portions 102 are in close contact with each other, thereby dividing the space at the base end side of the pin insertion hole 101 and the space at the tip end side of the pin insertion hole 101 from each other.
    [0047] [0047] As shown in FIG. 2, the molding step S3 is performed after the accommodation step S2, thus completing the method of manufacturing the semiconductor device 1.
    [0048] [0048] In the molding step S3, the semiconductor device 1 is taken out of the mold 100 after the resin forming the sealing resin portion 4 and the covering resin portion 5 is cured. When taking the semiconductor device 1 out of the mold 100, first, the driving member 130 is moved upward with respect to the upper mold 120, so that the pair of slide portions 102 corresponding to each pin insertion holes 101 slides in the direction in which they separate from each other. Thereafter, the upper mold 120 and the lower mold 110 are moved away from each other, so that the semiconductor device 1 can be taken out of the mold 100.
    [0049] [0049] Further, in the manufacturing method of the present embodiment, after the semiconductor device 1 is taken out of the mold 100, the frame portion 13 of the lead frame 7 protruding from the sealing resin portion 4 is cut off. Thereby, the semiconductor device 1 shown in FIG. 1 is completed.
    [0050] [0050] As described above, according to the semiconductor device 1 of the present embodiment, the base end portions 22A of the second portions 22 of the plurality of pin terminals 3 protruding from the upper surface 4a (outer surface) of the sealing resin portion 4 are each covered with the cylindrical covering resin portion 5 extending from the upper surface 4a of the sealing resin portion 4. Therefore, the creeping distance R1 from the predetermined pin terminal 3 to the other pin terminal 3 is the distance which is a sum of the length of the outer surface of the sealing resin portion 4 and the lengths of the outer surfaces of the two covering resin portions 5 which respectively cover the two pin terminals 3 (see FIG. 1). That is, the creeping distance R1 from a predetermined pin terminal 3 to another pin terminal 3 can be extended. As a result, even if the distance between two adjacent pin terminals 3 is reduced, it is possible to secure the creeping distance R1. As a result, the semiconductor device 1 can be miniaturized.
    [0051] [0051] According to the method of manufacturing the semiconductor device 1 of the present embodiment, the semiconductor device 1 of the present embodiment can be manufactured.
    [0052] [0052] According to the semiconductor device 1 of the present embodiment, the first portions 21 of the plurality of pin terminals 3 are respectively inserted into the plurality of insertion holes 12 of the lead frame 7. Further, according to the method of manufacturing the semiconductor device 1 of the present embodiment, in the connection step S1, the first portions 21 of the plurality of pin terminals 3 are respectively inserted into the plurality of insertion holes 12 of the lead frame 7.
    [0053] [0053] Accordingly, it is possible to suppress or prevent the base end portion 22A of the second portion 22 of the pin terminal 3 from, for example, coming into contact with the inner circumference of the pin insertion hole 101, thereby causing the base end portion 22A of the second portion 22 of the pin terminal 3 to be exposed from the covering resin portion 5. That is, the base end portions 22A of the second portions 22 of the plurality of pin terminals 3 can be reliably covered with the covering resin portions 5. Further, the thickness of the covering resin portion 5 in the circumferential direction of the pin terminal 3 can be made uniform.
    [0054] [0054] In the semiconductor device 1 and the method of manufacturing the semiconductor device 1 according to the present embodiment, the overhanging portion 23 formed in the first portion 21 of each pin terminal 3 is in surface contact with the first main surface 7a (main surface) of the lead frame 7. Thereby, each pin terminal 3 can stably be attached to the lead frame 7. For example. in a state in which the first portion 21 of each pin terminal 3 is inserted into the insertion hole 12 of the lead frame 7, it is possible to prevent deviation of the direction of the axis of the pin terminal 3 with respect to the first main surface 7a of the lead frame 7. Therefore, the plurality of pin terminals 3 can be positioned with respect to the lead frame 7 with higher accuracy.
    [0055] [0055] In the semiconductor device 1 of the present embodiment, the lead frame 7 and the wiring substrate 8 which constitute the wiring of the circuit unit 2 are arranged In the thickness direction thereof. That is, the wiring of the circuit unit 2 is divided into two layers. Therefore, the size of the semiconductor device 1 in the direction orthogonal to the thickness direction of the lead frame 7 or the wiring substrate 8 can be reduced as compared to the case where the wiring of the circuit unit 2 is formed in one layer. Therefore, the semiconductor device 1 can be further miniaturized.
    [0056] [0056] In the semiconductor device 1 of the present embodiment, since the wiring ofthe circuit unit 2 is configured by the lead frame 7 and the wiring unit 30 of the wiring substrate 8 which are arranged in the plate thickness direction, the length of the wiring in the circuit unit 2 can be shortened. Therefore, the resistance and the inductance of the wiring of the circuit unit 2 can be reduced.
    [0057] [0057] According to the semiconductor device 1 of the present embodiment, the semiconductor chip 6 is joined to the first metal plate portion 32 formed on the first main surface 31a of the ceramic plate 31. In addition, the second metal plate portion 33 formed on the second main surface 31b of the ceramic plate 31 is formed in the region overlapping the first metal plate portion 32 in the thickness direction of the ceramic plate 31, and is exposed to the lower surface 4b (outer surface) of the sealing resin portion 4. Therefore, the heat generated in the semiconductor chip 6 can be efficiently dissipated to the outside of the semiconductor device 1 through the ceramic substrate 8 (the first metalplate portion 32, the ceramic plate 31, the second metal plate portion 33). In particular, by placing the semiconductor device 1 on a heat dissipation member so that the second metal plate portion 33 contacts the heat dissipation member made of aluminum or the like, the heat of the semiconductor chip 6 can be efficiently dissipated to the heat dissipation member.
    [0058] [0058] According to the method of manufacturing the semiconductor device 1 of the present embodiment, the pair of slide portions 102 of the mold 100 is formed in a plate shape whose thickness direction is the extending direction of the pin insertion hole 101.
    [0059] [0059] For example, when the longitudinal direction of the second portion 22 of the pin terminal 3 inserted into the pin insertion hole 101 is inclined with respect to the extending direction of the pin insertion hole 101, if the pair of slide portions 102 sandwiches the entire tip end portion 22B of the second portions 22 of the pin terminal 3, a gap may be generated between each slide portion 102 and the outer circumference ofthe pin terminal 3. Further, it is not preferable that the pair of slide portions 102 sandwich the entire tip end portion 22B of the second portion 22 of the pin terminal 3 because a stress to bend the second portion 22 of the pin terminal 3 acts on the second portion 22.
    [0060] [0060] According to the method of manufacturing the semiconductor device 1 of the present embodiment, when the tp end portion 22B of the second portion 22 of each pin terminal 3 is sandwiched by the pair of slide portions 102 in the accommodation step S2, the tip end portions of the pair of slide portions 102 each bite into the outer circumference of the tip end portion 22B of the second portion 22 of the pin terminal 3. In particular, in the present embodiment, since the tip end portion 102A of each slide portion 102 is formed in the tapered shape, the tip end portion 102A of each slide portion 102 can reliably bite into the outer circumference of the tip end portion 22B of thesecond portion 22 of the pin terminal 3. Thus, it is possible to reliably prevent the resin flowing into the second cavity C2 from reaching the outer circumference of the tip end portion 22B of the second portion 22 of each pin terminal 3 in the molding step S3.
    [0061] [0061] As described above, although the details of the present invention have been described, the present invention is not limited to the embodiment described above, and various changes can be added without deviating from the gist of the present invention.DESCRIPTION OF REFERENCE NUMERALS
    [0062] [0062] 1 semiconductor device 2 circuit unit 3 pin terminal 4 sealing resin portion 4a upper surface (outer surface) 4b bottom surface (outer surface) 5 covering resin portion 6 semiconductor chip 7 lead frame 7a first main surface 7b second main surface 8 ceramic substrate (wiring substrate) 12 insertion hole 21 first portion 22 second portion
    22A base end portion 22B tip end portion 23 overhanging portion 25 recessed portion 30 wiring unit
    31 ceramic plate 3la first main surface 31b second main surface 32 first metal plate portion
    33 second metal plate portion 100 mold 101 pin insertion hole 102 slide portion 102A tip end portion
    110 lower mold 120 upper mold 130 driving member
    权利要求:
    Claims (10)
    [1]
    A semiconductor device comprising: a switching unit with a semiconductor chip; a plurality of rod-shaped pin terminals extending in the same direction from the switch unit and electrically connected to the switch unit; a sealing resin portion which seals the switch unit and first portions of the plurality of pin terminals positioned on one side of the switch unit; and a plurality of cylindrically shaped capping resin portions extending integrally from an outer surface of the sealing resin portion, from which project second portions of the plurality of pin terminals, the plurality of capping resin portions and the base ends of the plurality of second portions disposed on one side of the sealing resin portion, respectively pin connections covered.
    [2]
    The semiconductor device according to claim 1, wherein the switching unit comprises a plate-shaped connection frame that configures a wiring of the switching unit, the connection frame is formed with a number of insertion holes penetrating in a thickness direction of the connection frame, and the first parts of the number of pin connections in respective insertion holes are inserted.
    [3]
    The semiconductor device according to claim 2, wherein the first portion of the pin terminal is formed with an overhanging portion that overhangs from an outer periphery of the pin terminal and in surface contact with a major surface of the terminal frame.
    [4]
    The semiconductor device according to claim 2 or 3, wherein the second portion of the pin terminal is positioned on one side of a first major surface of the terminal frame, which terminal frame has a second major surface opposite the first major surface, and the semiconductor device comprises a wiring substrate with a wiring unit, wherein the wiring unit and terminal frame form the wiring of the switching unit, and the wiring substrate is disposed opposite the second major surface of the terminal frame and sealed in the sealing resin portion, and part of the first portion of the pin terminal projecting from the second major surface of the connection frame is connected to the wiring unit wiring unit.
    [5]
    The semiconductor device according to claim 4, wherein the wiring substrate comprises a ceramic substrate having a ceramic plate and with metal plate portions formed on both major surfaces of the ceramic plate, a first metal plate portion on a first major surface of the ceramic plate opposite the second major surface of the ceramic plate. terminal frame forms the wiring unit, the semiconductor chip is connected to the first metal sheet portion, and a second metal sheet portion on a second major surface of the ceramic sheet is provided in an area overlapping the first metal sheet portion in the thickness direction of the ceramic sheet, and 1s exposed to an outer surface of the sealing resin portion.
    [6]
    A production method for semiconductor devices comprising: a connecting step of electrically connecting a plurality of pin terminals to a switch unit so that the plurality of rod-shaped pin terminals extend in the same direction from the switch unit to a semiconductor chip; after the connecting step, an accommodation step of accommodating the switching unit and first portions of the plurality of pin terminals positioned on one side of the switching unit in a first cavity of a mold, and inserting second portions of the plurality of pin terminals into a plurality of pin insertion holes, respectively from the die extending from an inner surface of the first cavity; after the accommodation step, a casting step of pouring a resin into the first cavity to form a sealing resin portion sealing the switch unit and the first portions of the plurality of pin terminals, in the accommodation step, after inserting the second portions of the plurality of pin connectors, respectively in the number of pin insertion holes, a pair of sliding portions of the die are moved to project from an inner circumference of each pin insertion hole, in a direction away from the first cavity, on either side of a tip end of the second portion of each pin connector. a plurality of second cavities are connected to the first cavity, the number of second cavities being surrounded by a nut circumference of a base end portion of the second portion of each pin connection close to the first cavity, the inner circumference of each pin insertion hole, and the pair of sliding portions, and in the molding step, the resin is introduced into the second cavity about ee n to form a number of cylindrical capping resin portions which cover the base end portions of the second portions of the plurality of pin terminals, respectively.
    [7]
    The semiconductor device manufacturing method according to claim 6, wherein: the pair of sliders are each plate-shaped with the thickness direction extending in a direction of the pin insertion hole, and in the accommodation step a portion of the tip end of the second portion of each pin connector adjacent to the base end portion of the second portion of the pin connector is clamped by the pair of sliding portions.
    [8]
    The semiconductor device manufacturing method according to claim 7, wherein: in the accommodation step, when the tip end of the second portion of each pin connector is clamped by the pair of sliding portions, ends of the pair of sliding portions protruding from the inner periphery of each pin insertion hole to the outermost circumference of the tip end of the second portion of each pin connector.
    [9]
    The semiconductor device manufacturing method according to claim 8, wherein the ends of the slide portions are tapered.
    [10]
    The semiconductor device manufacturing method according to any one of claims 6 to 9, wherein: the switch unit comprises a plate-shaped connection frame, which forms a wiring of the switch unit, which connection frame is formed with a number of insertion holes penetrating in a thickness direction of the connection window, and wherein in the connecting step, the first portions of the plurality of pin terminals are inserted into the plurality of insertion holes, respectively.
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    同族专利:
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    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    PCT/JP2018/046875|WO2020129195A1|2018-12-19|2018-12-19|Semiconductor device and method for manufacturing semiconductor device|
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